Design and Engineering Support
Design Rule Check
Counselling Service
Prototypes, Samples, Mass Production
Single Layer, Double & Multi-Layers (over 40 layers)
Rigid, Flex & Mixed Multi-Layers Rigid / Flex
Variety of Sizes and Shapes
Special Technologies
| Variety of Finishes: | Hot Air Solder Levelling, Sn/ Pb reflowed, Passivated copper surfaces |
| | Ni/ Au galvanic, Ni chemical/ immersion Au, bondable and solderable |
| | Ni chemical/ Pd/ Au in various layups |
| | Pd chemical/ immersion Au, Au wire bondable and solderable |
| | Sn chemical, Carbon printing, Solder paste (reflowed), Protective resist |
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| Variety of Material: | FR2-5, CEM1,3, Aramid/Epoxid/CE, Epoxid-Material |
| | BT-Hoch TG, Gore-Ply (Epoxid/CE), Halogenfreie Epoxid-Material |
| | Polyimid-Glas, Polyimid Flex |
Complex & Dense Boards
High Aspect Ratio
Laser and Plasma micro via, blind via, buried via
Controlled Impedance & Process
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